Las Vegas, Venetian Expo Floor 1, #42557
Physical AI needs a new last-meter link
We engineered an electric-field PHY that enables always-on, low-latency edge AI across your personal devices.
Join the Revolution →Engineering the Second Nervous System for Physical AI Co-pilots
- Human-AI collaboration demands continuous context.
- Continuous context lives in your personal space.
- The last-meter link is the bottleneck.
- RF radiates. Confinement wins.
- So we built Electro-Quasistatic (EQS) connectivity in silicon.
1 mW at 5 Mbps • < 1 ms latency • Private by physics
SILICON SHIPPING
From 0.01Mbit/s prototype to 5 Mbit/s production silicon in just 4 years (2021 to 2025)
Team
Built by Silicon Veterans
We are an ultra-low-power mixed-signal team that turns first-principles physics into shipped silicon. We have lived through tapeouts, bring-up, characterization, and adoption
- AI-accelerated design: 5-month tapeout cycles
- 25+ patents filed annually on novel physics
- Full-custom low-power optimization for every block
Execution Velocity
From fundamental physics to production silicon
Commercial Launch & Dev Kits
Production-grade silicon shipping to partners
World's First Wi-R Video Stream
Gen 2 Silicon achieves high-bandwidth milestone
First Wi-R Silicon Sampling
Gen 1 Chip debut at CES '23
Proof of Concept Silicon
0.01Mbit/s prototype proves the physics
The Physics Era
Foundational Research at Purdue University
Validated Silicon
Shipping to Partners
Our XA-NFE2001 transceiver is validated, characterized, and shipping to major device manufacturers. Secure your evaluation kit and start designing the future.
The Partner Ecosystem
The Silicon Choice for Always-On Intelligence
From Tier-1 OEMs to advanced defense research, leading organizations rely on our silicon to break the power barrier. We provide the foundational connectivity for the upcoming always-on AI co-pilot decade.
Research Partners
Purdue University
NSF
Government & Defense
U.S. Army
USSOCOM
Defense Innovation Unit
U.S. Air Force
Industry Partners
Tier-1 Smartphone OEM
Tier-1 Wearables Partner
Tier-1 Platform Partner
Culture & Careers
Architect the Second Nervous System
We are building the silicon backbone of the AI era. This requires more than standard design, it demands first-principles thinking. Join the team that is closing the gap between biological and digital intelligence, from equation to tapeout.
From Physics to Product
We design novel mixed-signal architectures from first principles. We treat physics as the only hard constraint, ignoring industry convention.
Architect the New Standard
Build the foundational connectivity layer that the next generation of physical AI will rely on.
High-Velocity Execution
We move fast. With 5-month tapeout cycles and rapid validation, you will see your designs in silicon faster than anywhere else in the industry.